Camera module assembly adhesive, glue & sealant application

Bonding camera modules solutions: In the electronic sector, adhesives are employed in particular for mobile phones and smartphone camera modules. This includes bonding individual parts such as the lens into the lens mount or lens mount onto the sensor of the camera fixating the camera's chip onto the circuit board (die attach), use of the adhesive as chip underfill as well as bonding low-pass filters, and gluing the camera modules into the device housing.

Special adhesives allow precision assembly and durable glueing of ever-smaller component parts of camera modules. The adhesives can be used for production on a large scale of camera modules and cure quickly at low temperatures.

Lens bonding for mini cameras

The lenses and smaller modules of smartphone cameras are joined by adhesives. The table below provides a selection of adhesives that are recommended for bonding camera modules. Additional products and customized solutions are available upon demand. Visit the website http://www.deepmaterialar.com/ to know more.

https://i.ibb.co/0Z80ysC/fabricant-4-1.jpg

Adhesives for Camera Module Assembly

Camera modules are becoming increasingly utilized in our everyday devices. Increased consumer demand for safety has prompted the creation of sophisticated drivers assistance programs (ADAS) in cars. Smartphones are now able to have two, three or even four camera systems in a single device to provide user capabilities previously only available through top-of-the-line photography equipment. The increase in smart home devices has also introduced more cameras into our lives: smart doorbells as well as home hubs, security systems and even dog treat dispensers feature cameras for live streaming. Due to the need to further miniaturize camera components and improve reliability Camera module makers are becoming increasingly demanding assembly materials. Chemence's range of UV and dual-cure adhesives is designed to satisfy all أفضل مصنع لاصق needs for most applications, including FPC reinforcement as well as image sensor bonding IR filter bonding lens bonding, barrel mounting, VCM assembly, and perhaps Active alignment.

Active Alignment: This requirement to deliver high-quality images requires precise and solid camera module placement and fixing solutions. Deepmaterial dual-cure adhesive for active alignment assembly. The UV- and heat curing adhesives allow for quick dispensing, rapid setting and solid heat cure in shaded regions. Each product that is active aligned has excellent adhesion to the most critical substrates with very low outgassing and shrinkage characteristics, ensuring long-term component reliability.

Lens Bonding Lens bonds and barrels for lenses requires adhesives that are highly specialized in performance properties. Precision substrates demand that low temperature processing is critical to minimize distortion to the substrate. Additionally, a high thixotropic index as well as low emissions are crucial for ensuring that adhesive does not spread to unwanted areas and contaminate components. Apart from providing superior adhesion to substrates like LCP as well as PA and increased shock absorption and impact resistance Deepmaterial lens-bonding adhesives also fulfill these requirements in terms of performance.

FPC Ruggedization: Camera modules are often linked to their assembly by flexible printed circuit (FPC). Apart from excellent resistivity to peeling, flexibility and water resistance, Deepmaterial UV-curable adhesives offer excellent adhesion to FPC substrates like polyimide and polyester.